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The new OCZ PC2-9000 Titanium Alpha VX2 DFI Special is optimized for our new LANParty UT NF590 SLI-M2R enthusiast board, and together these two premium components will push your overclocking milestone beyond any other motherboard and memory solution. <br />
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As a member of the proprietary Voltage eXtreme family, the PC2-9000 VX2 DFI Special is designed to operate at a high voltage in order to increase the speed while maintaining stability that is usually unobtainable when conventional modules are pushed to run at a higher voltage. At DDR2-1120, the Ti Alpha VX2 supports ultra-low timings of 5-5-5 at 2.4 volts without any adverse affects to stability whatsoever. OCZ and DFI exclusively developed these modules for the extreme enthusiast to give high-end DDR2 based systems that extra performance edge that is demanded by today’s hard core gamers and overclockers. <br />
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<p align="center"><img src="http://www.amdplanet.it/art_img/sergio-news/TiAlphaDDR2_d2.jpg" width="430" height="350" /></p>
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The new OCZ PC2-9000 Titanium Alpha modules feature exclusive, multicolored XTC (Xtreme Thermal Convection) heatspreaders implementing an innovative Titanium deposition coating process that is resistant to scratches. Each Titanium Alpha module has its own unique color scheme and displays interchanging shades depending on the lighting and angle of the heatspreader. No two Titanium Alpha modules look alike. <br />
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PC2-9000 DFI Special Edition modules are 100% hand-tested to ensure compliance with stringent quality standards. In addition, each member of the OCZ Titanium Alpha family is backed by an industry-leading lifetime warranty, toll-free technical support and the exclusive EVP (Extended Voltage Protection) coverage. <br />
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The new PC2-9000 VX2 presents hardcore enthusiasts with, not only the world’s fastest memory product, but also a complete platform offering—one that delivers the highest level of compatibility and performance to those AM2 enthusiasts looking for the ultimate total overclocking solution.<br />
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* XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained. <br />
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**OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 2.4V ± 5% without invalidating their OCZ Lifetime Warranty. (SG)</p>
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